Polyimide precursor, polyimide and metalization structure using

Details Polyimide precursor, polyimide and metalization structure using Polyimide precursor, polyimide and metalization structure using

1993-01-29

1996-07-16

Acquah, Samuel A.

Stock material or miscellaneous articles

Composite

Of metal

4284735, 428901, 528353, B32B 1508

Patent

active

055365841

ABSTRACT:
A metalization structure uses a surface protective film formed of a polyimide that is produced by heating and dehydrating polyimide precursor has its molecular chain composed of recurring units represented by the following general formula (1) and recurring units represented by the following general formula (2): ##STR1## (where R.sup.1 is at least one tetravalent organic group selected from among ##STR2## R.sup.2 is at least one divalent organic group of a linear structure as selected from among ##STR3## and R.sup.3 is a divalent organic group of a crooked structure that has at least two aromatic rings).

REFERENCES:
patent: 4736012 (1988-04-01), Shoji et al.
patent: 4764413 (1988-08-01), Nukii et al.
patent: 5037709 (1991-08-01), Tomomura et al.
patent: 5059677 (1991-10-01), Kohtoh et al.
patent: 5272247 (1993-12-01), Sotokawa et al.

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