Solder cream

Details Solder cream Solder cream

1986-02-03

1987-04-14

Hayes, Lorenzo B.

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106 114, 106 118, 106 119, 148 24, 148 25, C09D 500, B23K 3534

Patent

active

046575898

ABSTRACT:
A solder composition containing a small amount of gold added to the solder metal, to avoid cracking of solder joints in electronic circuits, particularly densely packed microelectronic circuits, during thermal cycling. The solder composition comprises 85 to 90% of total solder metal and 10 to 15% of a vehicle for the solder metal, the solder metal containing about 0.2 to about 3% of particulate gold, by weight of the solder metal.

REFERENCES:
patent: 3915729 (1975-10-01), Eustice
patent: 4373974 (1983-02-01), Barajas
patent: 4509994 (1985-04-01), Barajas
patent: 4531986 (1985-07-01), Barajas

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