Method for producing resin-molded semiconductor device having he

Details Method for producing resin-molded semiconductor device having he Method for producing resin-molded semiconductor device having he

1984-01-17

1987-03-17

Hearn, Brian E.

Metal working

Method of mechanical manufacture

Assembling or joining

29576S, 29589, 29590, 29591, 26427217, 357 72, 357 80, H01L 2156, H01L 2158

Patent

active

046496378

ABSTRACT:
A lead frame has a plurality of metallic heat radiating plates, leads connected to each metallic heat radiating plate, other leads separated from the metallic heat radiating plates and a common insulator web attached to the metallic heat radiating plates. When the lead frame is placed in the cavity of a mold, the metallic heat radiating plates are correctly positioned in the mold cavity by means of the insulating web and the connected leads. By effecting a resin molding under this condition, the metallic heat radiating plates are molded in resin such that a layer of resin with a uniform thickness cover the back surface of the respective metallic heat radiating plates.

REFERENCES:
patent: 4451973 (1984-06-01), Tateno et al.

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