Polymers for use in heat resistant photoresist composition and p

Details Polymers for use in heat resistant photoresist composition and p Polymers for use in heat resistant photoresist composition and p

1979-12-17

1982-02-23

Cockeram, H. S.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

20415914, 20415919, 20415923, 20415918, 430281, 430288, 525420, 525423, 525424, 525426, 525419, 525430, 525436, 525449, 525452, 525454, 525455, C08G 7310, C08F 800

Patent

active

043169740

ABSTRACT:
An organic polar solvent-soluble aromatic polyamide-imide having therein aromatic nuclei linked at their respective 1 - and 3 - positions and having therein amide linkages and terminal groups unsubstituted or partially substituted with acrylate or methacrylate groups is found to impart excellent heat resistance and insulating property to a photoresist composition produced therefrom.

REFERENCES:
patent: 2623870 (1971-11-01), Curran et al.
patent: 3918973 (1975-11-01), Meriens
patent: 3929713 (1975-12-01), D'Alelio
patent: 4048144 (1977-09-01), Stephens
patent: 4093461 (1978-06-01), Loprest et al.
patent: 4106943 (1978-08-01), Ikeda et al.
patent: 4180404 (1979-12-01), Ohmura et al.
patent: 4208477 (1980-06-01), Ohmura et al.

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