Method for making a pre-testable semiconductor die package

Details Method for making a pre-testable semiconductor die package Method for making a pre-testable semiconductor die package

1987-06-18

1989-01-31

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437 8, 29835, 29841, 29741, 29593, 26427211, 26427215, 174 522, 174 524, H01L 500, H01L 2348

Patent

active

048015610

ABSTRACT:
An encapsulated die package (20) is shown in which a semiconductor die is connected in a die-attach aperture of a copper foil tape (11). Die contact pads (31) are bonded to the inner ends (31a) of interconnected finger contacts (13) on the tape. Finger contacts etched in the foil include splayed out portions (15) extending to probe ends (19). Interconnect cross-links (16) initially connect the finger contacts and the tape edges and function as dam bars in subsequent encapsulation steps. The die and die bonds are mold encapsulated to form the die package (20) and a carrier frame (17) is simultaneously molded around and spaced from the periphery of package (20). The probe ends are exposed within a slot (34) in the frame or extend from the ends of the frame so that probe tips can be pressed thereon to test the die and its bonds. Prior to testing, the interconnects exposed in the annulus between the package and the carrier are blanked out so that each finger leading from a die contact pad becomes discrete, i.e. is no longer interconnected to an adjoining finger, so that testing of each die contact and bond can be done. The stiff molded carrier acts to support the probe ends of the fingers and protects and stiffens the foil tape for the testing operations and for shipping and handling purposes.

REFERENCES:
patent: 3444440 (1969-05-01), Bell et al.
patent: 3611061 (1971-10-01), Segerson
patent: 3689991 (1972-09-01), Aird
patent: 3838984 (1974-10-01), Crane et al.
patent: 4132856 (1979-01-01), Hutchison et al.
patent: 4380042 (1983-03-01), Angelucci, Sr. et al.
patent: 4499333 (1985-02-01), Chee et al.
patent: 4630096 (1986-12-01), Drye et al.
patent: 4649415 (1987-03-01), Hebert

Affiliated with

Also associated with

Rating

Method for making a pre-testable semiconductor die package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for making a pre-testable semiconductor die package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for making a pre-testable semiconductor die package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-177438