Electronic component manufacturing method

Details Electronic component manufacturing method Electronic component manufacturing method

1999-02-16

2000-06-27

Young, Lee

Metal working

Method of mechanical manufacture

Electrical device making

29832, 29835, 174 521, 361816, H05K 334

Patent

active

060790997

ABSTRACT:
A manufacturing method of an electronic component comprises the steps of: mounting components on a sheet substrate having a plurality of component-mounting substrates and a plurality of through holes on which shield case-mounting electrodes are respectively formed; establishing a state in which a plurality of shield case pawls are inserted into the plurality of through holes to cover the components with shield cases, and solder is buried in the plurality of through holes; thereafter securing the plurality of shield cases to the sheet substrate to cover the components by melting the solder to secure the shield case pawls to the shield case-mounting electrodes of the through holes by the solder; and thereafter dividing the sheet substrate into the plurality of component-mounting substrates by cutting the sheet substrate, thereby producing a plurality of the electronic components each including the component-mounting substrate, the component mounted on the component-mounting substrate and the shield case secured to the component-mounting substrate for covering the component.

REFERENCES:
patent: 3337950 (1967-08-01), Gray
patent: 4714905 (1987-12-01), Bernstein et al.
patent: 4841414 (1989-06-01), Hibino et al.
patent: 4908936 (1990-03-01), Matsuura
patent: 5093282 (1992-03-01), Ohno et al.
patent: 5311402 (1994-05-01), Kobayashi et al.
patent: 5559676 (1996-09-01), Gessaman
patent: 5581875 (1996-12-01), Hibino et al.
patent: 5933946 (1999-08-01), Habermeier et al.

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