Process for electroplating palladium on articles comprising copp

Details Process for electroplating palladium on articles comprising copp Process for electroplating palladium on articles comprising copp

1980-09-26

1982-02-23

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

204 47, C25D 352, C25D 534

Patent

active

043167799

ABSTRACT:
A process and bath composition is described for the electroplating of palladium. The bath contains a source of palladium and thiourea or related compounds to prevent poisoning of the bath from copper ions contained on surfaces to be plated. It is particularly useful in palladium electroplating processes where foreign ions such as copper ions adversely affect the plating process. Such contamination is likely to occur where palladium is electroplated on copper or copper alloy surfaces such as are used in electrical contact devices such as switches, relays, connectors, etc. The palladium electroplating process and bath described in the disclosure yields excellent results even where extensive impurities such as copper ions have been introduced into the plating bath.

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patent: 1970950 (1934-08-01), Wise
patent: 1981715 (1934-11-01), Atkinson
patent: 1993623 (1935-03-01), Raper
patent: 2452308 (1948-10-01), Lambros
patent: 3150065 (1964-09-01), Fatzer
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patent: 4098656 (1978-07-01), Deuber
Metal Finishing Guidebook and Directory, p. 360, (1974).

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