Devices using silicone pressure sensitive adhesives containing o

Details Devices using silicone pressure sensitive adhesives containing o Devices using silicone pressure sensitive adhesives containing o

1996-06-06

2000-06-27

Brouillette, D. Gabrielle

Drug, bio-affecting and body treating compositions

Preparations characterized by special physical form

Web, sheet or filament bases; compositions of bandages; or...

424448, 524277, 524487, 525478, A61F 1302

Patent

active

RE0367540

ABSTRACT:
Hot-melt silicone pressure sensitive adhesive compositions containing organic waxes, methods of using the compositions and devices made using the compositions are disclosed. The hot-melt silicone pressure sensitive adhesive compositions include a mixture of (i) a silicate resin, (ii) a silicone fluid, and (iii) an organic wax having a melting point of between 30.degree. C. and 150.degree. C. The organic wax decreases dynamic viscosity of the adhesive at temperatures equal to or below about 200.degree. C.

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patent: 4942037 (1990-07-01), Bondi et al.
patent: 4990561 (1991-02-01), Yoshioka
patent: 5006342 (1991-04-01), Cleary et al.
patent: 5133972 (1992-07-01), Ferrini et al.

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