Method for making tape automated bonding (TAB) semiconductor dev

Metal working – Method of mechanical manufacture – Electrical device making

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437206, 437217, H01R 4300

Patent

active

053614909

ABSTRACT:
Deformation of TAB tapes due to temperature changes is prevented by thermo-mechanical leads. In one embodiment of the invention, a semiconductor device (30) includes an electronic component (31) and a TAB tape. The tape includes a carrier film (12) and electrical leads (20) formed on the carrier film. The electrical leads are electrically coupled to the electronic component. Also included on the carrier film are thermo-mechanical leads (32) which are formed in opposing regions of the carrier film, regions which are typically void of leads. The thermo-mechanical leads have approximately the same lead pitch as the electrical leads in order to provide a uniform distribution of stresses across the TAB tape upon exposure to varying temperatures.

REFERENCES:
patent: 4544238 (1985-10-01), Nickol
patent: 4721993 (1988-01-01), Walter
patent: 4803540 (1989-02-01), Moyer et al.
patent: 4859614 (1989-08-01), Sugahara et al.
patent: 4865193 (1989-09-01), Shimamoto et al.
patent: 4947237 (1990-08-01), Fusaroli
patent: 4977442 (1990-12-01), Suzuki et al.
patent: 5053852 (1991-01-01), Biswas et al.
Research Disclosure Document, "Stress Relief for Tape Automated Bonding (TAB) Tape," Oct. 1988, No. 29401, anonymously disclosed, Kenneth Mason Publications, Ltd., England.

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