Method for forming a thin film layer

Details Method for forming a thin film layer Method for forming a thin film layer

1993-02-01

1995-10-31

Wilczewski, Mary

Fishing, trapping, and vermin destroying

427 98, 427304, 427305, 427427, H01L 2102, C23C 2600

Patent

active

054628970

ABSTRACT:
A method for forming a thin film layer on a dielectric substrate. A nonconducting layer of material is blanket deposited on the dielectric substrate followed by a layer of polymeric dielectric material which is then patterned to partially expose the underlying layer of nonconducting material. The exposed underlying layer of material is contacted with a metallic salt solution. A key part of the present invention is the layer of nonconducting material which catalyzes the deposition of a seed layer from the metallic salt solution. Then, additional metallization may be easily electrolessly plated on the seed layer.

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