Electronics circuit device and method of making the same

Details Electronics circuit device and method of making the same Electronics circuit device and method of making the same

1978-02-28

1981-01-20

Wojciechowicz, Edward J.

357 55, 357 68, 357 69, 357 71, H01L 2348

Patent

active

042465958

ABSTRACT:
Principal faces of semiconductor devices (19) are bonded by means of a bond layer (17) on one face (lower face) of a heat-resistive flexible synthetic resin film (8, 16), for example, polyimide film, the other face (upper face) of the heat-resistive flexible synthetic resin film (8, 16) has bonded wiring conductor films (22) of a specified wiring pattern, and specified parts of electrode metal layers (20) or specified regions (66, 67) on the principal face of the semiconductor devices (19) and specified parts of the wiring conductor films (22) on the resin film (8, 16) are connected by conductor films (22) formed extending between them through through-holes with sloped wall (18, 18a, 32) formed on the resin film (18, 16). Also, a thin reinforcing frame (24) of a metal film, formed on said one (lower) face of the resin film (8, 16) with a specified pattern, may be connected to the wiring conductor films (22) through other through-holes (181) with sloped wall.

REFERENCES:
patent: 3868724 (1975-02-01), Perrino

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