Surface processing apparatus using neutral beam

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means

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216 71, C23F 102

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active

054626293

ABSTRACT:
A surface processing apparatus and a dry etching method using a neutral beam. The surface processing apparatus comprises a plasma chamber for generating a plasma P, a neutralizing chamber for converting an ion beam extracted from the plasma P by an ion extracting electrode into the neutral beam, and a processing chamber for introducing therein the neutral beam and etching a substrate S to be processed using the neutral beam. There is also provided a static electric field lens comprising two spaced first electrodes provided on the inner periphery of the neutralizing chamber and a second electrode interposed therebetween so as to obtain the neutral beams having low energy and high flux.

REFERENCES:
patent: 3664747 (1987-05-01), Sekiguchi et al.
patent: 3699334 (1972-10-01), Cohen et al.
patent: 4450031 (1984-05-01), Ono et al.
patent: 4457803 (1984-07-01), Takigawa
patent: 4487678 (1984-12-01), Noguchi et al.
patent: 4523971 (1985-06-01), Cuomo et al.
patent: 4624214 (1986-11-01), Suzuki et al.
patent: 4758304 (1988-07-01), McNeil et al.
patent: 4761199 (1988-08-01), Sato
patent: 4877479 (1989-10-01), McNeil et al.
patent: 5284544 (1994-02-01), Mizutani et al.

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