Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1994-04-26
1995-10-31
Simmons, David A.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
174 522, 257676, 257784, 437 67, 437 78, 437 90, 437203, B32B 3100
Patent
active
054626242
ABSTRACT:
Method and apparatus for connecting an I/O pad of an integrated circuit die to an electrical lead or contact on a lead frame that uses interposers formed directly on the die attach pad of the lead frame. Each interposer is formed by etching one or more grooves, preferably of depth no more than half the die attach pad thickness, in the die attach pad adjacent to the lead frame electrical lead(s). The exposed surfaces of the grooves and the die attach pad are coated with a layer of electrically insulating material, and the grooves are then filled with an electrically conducting material, such as conductive epoxy. An electrically conducting wire is then bonded between an I/O pad of an integrated circuit die and the electrically conducting material in the groove, and between the electrically conducting material and an electrical lead of a lead frame. Self-inductance and mutual inductance of the circuit line segments running from the die attach pad to the lead frame electrical lead(s) are reduced by control of the groove dimensions.
REFERENCES:
patent: 4038582 (1977-07-01), Horwinski
patent: 4327476 (1982-05-01), Iwai et al.
patent: 5052777 (1991-10-01), Ninnis et al.
patent: 5233130 (1993-08-01), Nishino
patent: 5240867 (1993-08-01), Suzuki et al.
patent: 5323035 (1994-06-01), Leedy
patent: 5341027 (1994-08-01), Park et al.
Hickman Paul
Rivard Paul M.
Simmons David A.
VLSI Technology Inc.
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