Low parasitic shunt diode package

Wave transmission lines and networks – Long line elements and components – Strip type

Patent

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Details

333223, 333245, H01P 504, H01P 1100, H01P 704

Patent

active

042465567

ABSTRACT:
A removable diode package for mounting beam-lead diodes in coaxial, stripline or waveguide microwave circuits is described. The diode package is capable of operation at frequencies above 40 GHz. A low-dielectric polyimide insulating washer is used to reduce parasitic elements normally associated with diode packages at microwave and millimeter frequencies.

REFERENCES:
patent: 3668551 (1972-06-01), Kondo
patent: 3896543 (1975-07-01), Colliver et al.
patent: 3916350 (1975-10-01), Swan

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