Method of manufacturing semiconductor devices in which a layer o

Details Method of manufacturing semiconductor devices in which a layer o Method of manufacturing semiconductor devices in which a layer o

1977-07-18

1978-10-10

Esposito, Michael F.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

422249, 427 46, 427 86, 427 87, 427113, 427398R, 427434A, 156604, 156607, 156620, 156DIG64, 23295R, B05D 512, B01D 902

Patent

active

041197445

ABSTRACT:
A method of manufacturing semiconductor devices comprising a layer of semiconductor material, comprising the steps of providing a strip-shaped solid substrate having a main surface and providing a solid support having a substantially horizontal surface and comprising a substantially floating liquid mass of such semiconductor material on the substantially horizontal surface, the main surface being wettable by the liquid semiconductor material. The liquid mass is contacted with the main surface of said substrate, onto which substrate the layer of semiconductor material is to be provided, the substrate is moved in its longitudinal direction along and in contact with said liquid mass so that a liquid layer of said semiconductor material is formed on said strip and taken along with it, and the liquid layer is substantially progressively solidified.

REFERENCES:
patent: 2147293 (1939-02-01), Hansen
patent: 2414680 (1947-01-01), Wert
patent: 3032816 (1962-08-01), Zimmerli
patent: 3096158 (1963-07-01), Gaule
patent: 3961997 (1976-06-01), Chu
patent: 3969163 (1976-07-01), Wakefield
patent: 3996094 (1976-12-01), Lesk

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