Semiconductor laser package and method of fabrication

Details Semiconductor laser package and method of fabrication Semiconductor laser package and method of fabrication

1996-10-15

1999-05-18

Bovernick, Rodney B.

Coherent light generators

Particular active media

Semiconductor

372 43, 369112, H01S3/18

Patent

active

059057505

ABSTRACT:
A semiconductor laser package including a laser chip mounted to an uppermost surface of a leadframe, and a molded structure at least partially encapsulating the laser chip. The laser chip composed of a vertical cavity surface emitting laser and an optional photodetector. The vertical cavity surface emitting laser generating an emission along a path. The molded structure including an optical element positioned a specific distance from an emission aperture of the vertical cavity surface emitting laser. The laser chip and the optical element mounted in precise z-axis alignment from the emission aperture of the vertical cavity surface emitting laser utilizing the uppermost surface of the leadframe as a dimensional reference point.

REFERENCES:
patent: 5136152 (1992-08-01), Lee
patent: 5352632 (1994-10-01), Sawaya
patent: 5361244 (1994-11-01), Nakamura et al.
patent: 5577064 (1996-11-01), Swirhun et al.
patent: 5608695 (1997-03-01), Yamazaki
patent: 5629919 (1997-05-01), Hayashi et al.

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