Method of manufacturing thick-film circuit devices

Details Method of manufacturing thick-film circuit devices Method of manufacturing thick-film circuit devices

1977-05-10

1978-10-10

Newsome, John H.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

427 43, 427 96, 427376A, 427376E, B05D 306

Patent

active

041194802

ABSTRACT:
A method of manufacturing thick-film circuit devices which comprises depositing a photosensitive resin on a substrate either before or after the deposition of a paste for thick-film circuit, exposing the photosensitive resin selectively to light and thereby forming a predetermined thick-film paste pattern, and then firing the paste pattern.

REFERENCES:
patent: 3075866 (1963-01-01), Baker et al.
patent: 3419425 (1968-12-01), Conrad
patent: 3575746 (1971-04-01), Cheskis et al.
patent: 3661635 (1972-05-01), Harrison
patent: 3712825 (1973-01-01), Yocum
patent: 3837885 (1974-09-01), Angelucci
patent: 3853560 (1974-12-01), Ohgoshi et al.
patent: 3958996 (1976-05-01), Inskip
patent: 3982941 (1976-09-01), Inskip
Desai et al., "IBM Tech. Disc. Bull.", vol. 16, #8, Jan. 1974, pp. 2644-2645.

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