Multi-level electronic module assembly

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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Details

361704, 361735, 361756, 361790, 16510433, 165 803, 257722, 343853, H05K7/20

Patent

active

059056355

ABSTRACT:
An assembly of electronic modules comprises electronic modules supported by a support structure. Each electronic module is in the form of electronic components stacked on at least two levels which are separated by an intermediate layer. Each electronic module comprises at least one hole formed in the intermediate layer. The support structure comprises at least one rod element that is introduced into respective holes of successive modules.

REFERENCES:
patent: 4283754 (1981-08-01), Parks
patent: 5128689 (1992-07-01), Wong et al.
patent: 5649310 (1997-07-01), Tyner et al.

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