Molded-in antenna with solderless interconnect

Details Molded-in antenna with solderless interconnect Molded-in antenna with solderless interconnect

1992-01-22

1993-11-02

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

343702, 379428, 379420, 379430, 379433, 455 90, 455347, 455351, 361728, 361736, 361752, H05K 712

Patent

active

052588920

ABSTRACT:
A communication device (10) includes a loop antenna (18) that is located within a molded portion of the housing (14) of the communication device, and an electrical contact (20) for the antenna that also provides a mechanical support for at least a portion of the communication device (10).

REFERENCES:
patent: 4092698 (1978-05-01), Brefka
patent: 4123756 (1978-10-01), Nagata et al.
patent: 4894663 (1990-01-01), Urbish et al.
patent: 4926291 (1990-05-01), Sarraf
patent: 5001603 (1991-03-01), Villaneuva, III et al.
patent: 5030963 (1991-07-01), Tadama
patent: 5148350 (1992-09-01), Chan et al.
patent: 5150282 (1992-09-01), Tomura et al.
patent: 5166868 (1992-11-01), Stanton et al.
patent: 5170173 (1992-12-01), Krenz et al.

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