Universal wafer carrier for wafer level die burn-in

Details Universal wafer carrier for wafer level die burn-in Universal wafer carrier for wafer level die burn-in

1996-05-06

1999-05-18

Karlsen, Ernest F.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324755, G01R31/02;1/073

Patent

active

059053828

ABSTRACT:
A reusable burn-in/test fixture for testing unsingulated dice on a semiconductor wafer consists of two halves. The first half of the test fixture is a die cavity plate for receiving the wafer, and the second half establishes electrical communication between the wafer and electrical test equipment. A rigid substrate has conductors thereon which establish electrical contact with the wafer. The test fixture need not be opened until the burn-in and electrical test are completed. After burn-in stress and electrical test, it is possible to establish interconnection between the single die separate and package the dice into discrete parts, arrays or clusters, either as singulated parts or as arrays.

REFERENCES:
patent: 4597617 (1986-07-01), Enochs
patent: 4766371 (1988-08-01), Moriya
patent: 4783719 (1988-11-01), Jamison et al.
patent: 4899107 (1990-02-01), Corbett et al.
patent: 5103557 (1992-04-01), Leedy
patent: 5123850 (1992-06-01), Elder et al.
patent: 5440240 (1995-08-01), Wood et al.

Affiliated with

Also associated with

Rating

Universal wafer carrier for wafer level die burn-in does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Universal wafer carrier for wafer level die burn-in, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Universal wafer carrier for wafer level die burn-in will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1762107