Process for manufacturing semiconductor device structures cooled

Fishing – trapping – and vermin destroying

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437220, 437902, H01L 2158, H01L 2160, H01L 2338

Patent

active

052293270

ABSTRACT:
A method for utilizing a single series operating current for providing operating power to an electronic device and adjacent cooling therefor while simultaneously increasing or decreasing the cooling in a manner directly proportional to increases and decreases in power consumption and heat dissipation from the electronic device. The electronic device is connected to a first power supply terminal and a Peltier cooling junction is connected to one side of the electronic device. A Peltier heating junction is connected to one side of the Peltier cooling junction remote from the electronic device, and a heat sink is connected between the Peltier heating junction and a second power supply terminal. In this manner, a single series electrical circuit may be used for simultaneously providing operating power to the electronic device and cooling the electronic device in proportion to heat dissipation requirements therefor. Advantageously, the Peltier cooling and heating junctions may be formed in a planar fashion on the surface of a semiconductor die and used to cool integrated circuits which are fabricated within the die.

REFERENCES:
patent: 4489742 (1989-12-01), Moore et al.

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