Package for microwave IC

Details Package for microwave IC Package for microwave IC

1991-10-22

1993-11-02

LaRoche, Eugene R.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

257684, 257698, 257728, 257706, 257711, H01L 2312, H01L 2314

Patent

active

052586464

ABSTRACT:
A microwave IC package comprises a base (1) and a plurality of cavities (2a) and (2b) for mounting IC chips (5a) and (5b), the cavities (2a) and (2b) being formed on the base (1). Also provided on the base (1) are terminals (4a), (4b), (8a), (8b) and (8c) which are connected to said IC chips by wire bonding. The cavities (2a) and (2b) are separated from each other by a grounded conductor (3A). Due to the separation, isolation between the input and the output of the IC package is improved.

REFERENCES:
patent: 4259684 (1981-03-01), Dean et al.
patent: 4639760 (1987-01-01), Granberg et al.
patent: 4649416 (1987-03-01), Borkowski et al.
patent: 4868639 (1989-09-01), Mugiya et al.
patent: 4901041 (1990-02-01), Pengelly
patent: 4933745 (1990-06-01), O'Shea et al.
patent: 4953001 (1990-08-01), Kaiser, Jr. et al.
patent: 4985753 (1991-01-01), Fujioka et al.
patent: 5045820 (1991-09-01), Leicht et al.
patent: 5138436 (1992-08-01), Koepf
10th GaAs IC Symposium 1988, CH2599-9/88, F. Ishitsuka et al.: "Low Cost, High-Performance Package for a Multi-Chip MMIC Module", pp. 221-224.

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