Multilayer interconnect device and method of manufacture thereof

Details Multilayer interconnect device and method of manufacture thereof Multilayer interconnect device and method of manufacture thereof

1990-10-23

1991-10-01

Griffin, Donald A.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

357 74, 156630, H05K 720, B44C 122, H01L 2302

Patent

active

050539213

ABSTRACT:
An interconnect device for electronic components, such as integrated circuits, multichip modules and the like, and the method of manufacture thereof are presented. The interconnect device has at least three layers of circuitry, one for signal transmission and two for voltage planes (power and ground). The interconnect device is made by a processing on a stainless steel carrier plate to achieve high lead count capability with fine line widths and spacing, as well as precise registration layer to layer. Laser drilling is used to define interconnect vias between signal and voltage (power and ground) plane layers.

REFERENCES:
patent: 4498122 (1985-02-01), Rainal
patent: 4744007 (1988-05-01), Watari et al.
patent: 4922325 (1990-05-01), Smeltz
patent: 4972253 (1990-11-01), Palino et al.
patent: 4991001 (1991-02-01), Takubo et al.

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