Molded resin semiconductor device

Details Molded resin semiconductor device Molded resin semiconductor device

1984-04-20

1989-07-18

Hille, Rolf

H01L 2328, H01L 2330

Patent

active

048498033

ABSTRACT:
Diode chips 5, 6 soldered to a terminal plate 4 within a housing 1, 2 are surrounded by a low thermal expansion, high thermal conductivity thermosetting resin 13, 14, in turn covered by a flexible resin 9 having high expansion and low conductivity coefficients, in turn covered by another thermosetting resin 12. Elastic lead wires 7, 8 soldered to the diodes and embedded in the flexible resin are extended through the top resin layer by further terminal plates 10, 11. Such construction enhances heat dissipation and reduces thermal stress concentrations to thereby avoid fatigue failure in the solder connections.

REFERENCES:
patent: 3496427 (1970-02-01), Lee et al.
patent: 3686542 (1972-08-01), Dinder et al.
patent: 3939488 (1976-02-01), Wakashima et al.
patent: 4001863 (1977-01-01), Kobayashi et al.
patent: 4039904 (1977-08-01), Klein et al.
patent: 4092487 (1978-05-01), Imai
patent: 4153910 (1979-05-01), Itoh et al.
patent: 4179725 (1979-12-01), Maguire

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