Method of manufacturing resin-encapsulated semiconductor device

Details Method of manufacturing resin-encapsulated semiconductor device Method of manufacturing resin-encapsulated semiconductor device

1992-03-16

1993-11-02

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437214, 437220, 26427217, 425806, H01L 2156, H01L 2158, H01L 21603

Patent

active

052583317

ABSTRACT:
A method for manufacturing a semiconductor device, which has the steps of connecting adjacent outer leads, with an insulating photoresist or prepeg material with a width locally provided only in areas with said width along the direction of arrangement of outer leads, and of resin-sealing areas other than said outer leads and said insulating material while preventing the outflow of sealing resin by way of said insulating photoresist or prepeg material.

REFERENCES:
patent: 3818584 (1974-06-01), Suenaga et al.

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