Method of making multi-layer wiring board

Details Method of making multi-layer wiring board Method of making multi-layer wiring board

1995-06-06

1997-01-07

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

174255, 174257, 174258, 174259, 428901, H05K 336

Patent

active

055904610

ABSTRACT:
A multi-layer wiring board has at least one stacking block with an insulating hard substrate, a grounding layer being provided in the insulating hard substrate. A plurality of wiring layers are provided over upper and lower major surfaces of the insulating hard substrate. A plurality of throughholes are provided in the insulating hard substrate for connecting wiring layers on the top and bottom surfaces of the substrate. A base block has an insulating base board, and at least one wiring layer provided over one major surface of the insulating base board. Connections electrically and mechanically connect the at least one stacking block and the base block. The stacking block and the base block may be simultaneously manufactured in parallel with others. The stacking block and the base block may be adhered to each other by an adhesive layer. Each electrical connection between the stacking block and the base block may be achieved with bumps and pads.

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patent: 5382757 (1995-01-01), Ishda
patent: 5396034 (1995-03-01), Fujita et al.

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