Electronic device sealing resin compositions and sealed electron

Details Electronic device sealing resin compositions and sealed electron Electronic device sealing resin compositions and sealed electron

1990-10-01

1993-06-29

Bleutge, John C.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

525523, 525537, 524265, C08K 334, C08F28310, C08F28312

Patent

active

052235572

ABSTRACT:
Disclosed herein are electronic device sealing resin compositions containing 100 parts by weight of a thermoplastic resin mixture composed of 25-60 wt. % of a poly(arylene sulfide) and 40-75 wt. % of an inorganic filler; and 1.5-5 parts by weight of an epoxy-modified silicone oil having an epoxy equivalent of 350-1,000 g/eqiv. Also disclosed are electronic devices sealed using such resin compositions.

REFERENCES:
patent: 4370292 (1983-01-01), Yanase et al.
patent: 4450266 (1984-05-01), Idel et al.
patent: 4645826 (1987-02-01), Iizuka et al.
patent: 4708983 (1987-11-01), Liang et al.
patent: 4743639 (1988-05-01), Liang et al.
patent: 4787991 (1988-11-01), Morozumi
patent: 4797448 (1989-01-01), Liang
patent: 5034446 (1991-07-01), Kendall et al.

Affiliated with

Also associated with

Rating

Electronic device sealing resin compositions and sealed electron does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electronic device sealing resin compositions and sealed electron, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic device sealing resin compositions and sealed electron will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1756110