Thermal and flow regulator with integrated flow optimizer

Automatic temperature and humidity regulation – Cooling radiator – Bypass

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

236 92C, 236 93A, G05D 2312

Patent

active

052286185

ABSTRACT:
A valve assembly is disclosed which includes a first valve disc positionable against a valve seat in response to sensed temperature. The first valve disc includes a central aperture which is closeable by a second valve disc held in position by a compression spring. The second valve disc is displaced in response to liquid pressure. The valve assembly thereby provides for the independent control of flow through a passageway in response to temperature and/or pressure. The valve assembly has a particular application in conjunction with the control of bypass flow for a continuous flow liquid heater.

REFERENCES:
patent: 1694492 (1928-12-01), Tabler
patent: 1972170 (1934-09-01), Spencer
patent: 2400615 (1946-05-01), Warrock et al.
patent: 2400911 (1946-05-01), Booth
patent: 2505321 (1950-04-01), Brutocao et al.
patent: 3428251 (1969-02-01), Gross et al.
patent: 3554440 (1971-01-01), Austin
patent: 3754706 (1973-08-01), Tao
patent: 4190198 (1980-02-01), Casuga et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Thermal and flow regulator with integrated flow optimizer does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermal and flow regulator with integrated flow optimizer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermal and flow regulator with integrated flow optimizer will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1755584

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.