Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Patent
1998-04-10
1999-05-18
Niebling, John F.
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
438126, 438127, H01L21/44;21/48;21/50
Patent
active
059045060
ABSTRACT:
A semiconductor device includes a rigid member embedded in a resin package body for supporting thereon outer leads that extend from the resin package body and test pads provided on the outer leads for testing the semiconductor device.
REFERENCES:
patent: 5296744 (1994-03-01), Liang et al.
Tsuji Kazuto
Yoneda Yoshiyuki
Fujitsu Limited
Niebling John F.
Zarneke David A.
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