Method and apparatus for semiconductor assembly which includes t

Details Method and apparatus for semiconductor assembly which includes t Method and apparatus for semiconductor assembly which includes t

1997-08-22

1999-05-18

Bowers, Charles

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

438109, 257692, 257693, 257678, H01L21/60;21/56

Patent

active

059044977

ABSTRACT:
A semiconductor assembly, and method for forming same, comprises a support such as a printed circuit board (PCB), at least one semiconductor die, and a surface plate manufactured from a material such as ceramic, plastic, silicon, or the like. The semiconductor die is removably attached to the PCB, and an electrical interconnect such as a wire bond electrically couples the PCB and the die. The surface plate is attached to the die and leaves exposed the terminals on the die. The die is burned in and tested. Responsive to the die passing the test, the surface plate is underfilled, for example with a glob top material, to seal the electrical interconnect and its attachment to the PCB and to the die. Responsive to the die failing the test, the die is removed and replaced with another die. Various other embodiments of the invention are described.

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