Semiconductor integrated circuit device

Semiconductor device manufacturing: process – With measuring or testing – Packaging or treatment of packaged semiconductor

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438 14, G01R31/26

Patent

active

059044888

ABSTRACT:
A semiconductor integrated circuit device includes: a base film made of insulating material; a wiring pattern of a predetermined shape formed on the base film; a semiconductor chip provided on the base film, wherein an electrode terminal of the semiconductor chip comes into contact with one end of the wiring pattern; and a flexible protective film having an insulating property, the flexible protective film being adhered onto the base film while it covers the semiconductor chip and one end of the wiring pattern.

REFERENCES:
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patent: 4246595 (1981-01-01), Noyori
patent: 4336551 (1982-06-01), Fujita et al.
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patent: 5083191 (1992-01-01), Ueda
patent: 5130793 (1992-07-01), McLellan
patent: 5516704 (1996-05-01), Yoshida
patent: 5525545 (1996-06-01), Grube et al.
patent: 5739050 (1998-04-01), Farnworth

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