Method of forming refractory metal film

Fishing – trapping – and vermin destroying

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

437243, 437246, H01L 21441

Patent

active

052234550

ABSTRACT:
A method for forming a refractory metal film on a substrate utilizes a reduction reaction of the halides of the refractory metal with respect to monosilane, disilane, or the halides of monosilane and disilane to form the refractory metal film while suppressing the reaction by adding a hydrogen gas. As a result, the refractory metal film is formed with good quality at a high speed, or deposited selectively on the nitrides, etc., of metal.

REFERENCES:
patent: 4501769 (1985-02-01), Hieber et al.
patent: 4629635 (1986-12-01), Brors
patent: 4684542 (1987-08-01), Jasinski et al.
patent: 4699801 (1987-10-01), Ito et al.
patent: 5071788 (1991-12-01), Joshi
patent: 5108952 (1992-04-01), Matsuhashi
Smith, "CVD Tungsten Contact Plugs by in situ Deposition and Etchback", Multilevel Interconnect. Conf., Santa Clara, Calif., Jun. 25-26, 1985.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of forming refractory metal film does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of forming refractory metal film, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming refractory metal film will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1755079

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.