Method of aligning and mounting an electronic device on a printe

Details Method of aligning and mounting an electronic device on a printe Method of aligning and mounting an electronic device on a printe

1990-08-14

1991-10-01

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437211, H01L 2160

Patent

active

050533576

ABSTRACT:
An electronic component having a flexible substrate with conductive traces thereon may have the leads separated into arrays that are shaped to contact and be surface mounted to the bonding lands on a printed circuit board (PCB). The flexible substrate, such as polyimide, adheres to the traces and is formed into lead arrays with them. The lead arrays thus keep portions of the leads and the outer bonding areas corresponding thereto aligned with respect to each other during handling and mounting to the PCB. An alignment mechanism may be optionally present on the lead arrays that mates with a corresponding mechanism on the PCB. The package body itself may be overmolded, assembled from prior parts, etc. Another alternative version includes test points on the perimeter of the substrate beyond the outer bonding areas that may be used to test the device, such as an integrated circuit chip or die, at an intermediate stage in the assembly process. The periphery and test points may be sheared away before the package is mounted to the PCB. A variety of outer bonding area pitches may be provided on the same package with test points of a standard pitch. The relatively inexpensive device is thin and easily mounted by conventional techniques.

REFERENCES:
patent: 3718969 (1973-03-01), Segerson
patent: 3911568 (1975-08-01), Hartleroad et al.
patent: 4411719 (1983-10-01), Lindberg
patent: 4742431 (1988-05-01), Igarashi
patent: 4744009 (1988-05-01), Grabbe et al.
patent: 4766670 (1988-08-01), Gazdik et al.
patent: 4783719 (1988-11-01), Jamison et al.
patent: 4792532 (1988-12-01), Ohtani et al.

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