Method for covering with cylindrically shaped heat-shrinkable fi

Details Method for covering with cylindrically shaped heat-shrinkable fi Method for covering with cylindrically shaped heat-shrinkable fi

1982-05-13

1984-03-27

Kittle, John E.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156165, 430 67, 430132, B29C 2720

Patent

active

044392583

ABSTRACT:
The present invention relates to a method for covering a substrate with a cylindrically shaped heat-shrinkable film, particularly to a method for covering a cylindrically shaped heat-shrinkable film so as to fit the contour of a substrate by conducting the heat treatment in multiple steps at different temperatures.

REFERENCES:
patent: 3734273 (1973-05-01), Watanabe
patent: 3819370 (1974-06-01), Komiya
patent: 3967993 (1976-07-01), Isomi

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