Solid state image sensor with cell array of amorphous semiconduc

Facsimile and static presentation processing – Facsimile – Recording apparatus

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H04N 314

Patent

active

047729511

ABSTRACT:
A contact-type linear image sensor has two separate substrates aligned adjacent to each other. A linear array of amorphous silicon photoelectric converting elements serving as photoelectric cells and a matrix wiring unit are provided on a first substrate. Driver IC chips are mounted on a second substrate. Connection pad patterns for common cell electrodes of cell groups and connection pad patterns for row signal lines of the matrix wiring unit are provided concentrically at a peripheral edge of the first substrate to be aligned along a junction edge line defined between the substrates. Connection pad patterns for the IC chips are linearly aligned at a peripheral edge of the second substrate and along the substrate junction edge line to oppose the pad patterns of the first substrate. A connector unit for electrically connecting the pad patterns of the first and second substrates may be provided at only one position of the junction edge portion of the first and second substrates.

REFERENCES:
patent: 4589026 (1986-05-01), Ozawa et al.
patent: 4660089 (1987-04-01), Lee
"Test Fabrication of Large Size Image Sensor For Facsimile", Kazumi Komiya et al., SSD77-56, 1977.

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