Mold for molding a package for a semiconductor device for detect

Details Mold for molding a package for a semiconductor device for detect Mold for molding a package for a semiconductor device for detect

1991-05-09

1992-06-16

Woo, Jay H.

Plastic article or earthenware shaping or treating: apparatus

Distinct means to feed, support or manipulate preform stock...

Opposed registering coacting female molds

249 95, 26427217, 425125, 425544, 425DIG228, B29C 4526, B29C 4514

Patent

active

051220458

ABSTRACT:
A mold for molding a semiconductor package including a semiconductor chip mounted on a lead frame, wherein a major surface of the semiconductor chip is inclined relative to a surface of the semiconductor package, the mold includes a first mold half including a first mold cavity having a first mold surface and at least four first side surfaces, a second mold half including a second mold cavity having a second main surface extending substantially parallel to the first main surface and at least four second side surfaces extending substantially perpendicular to the second main surface, and a portion for supporting the lead frame and the semiconductor chip in the first and second mold cavities and position the major surface of the semiconductor chip in an inclined position relative to the second main surface, wherein the portion for supporting and positioning includes a first mating surface on the first mold half inclined relative to the first main surface and a second mating surface on the second mold half inclined relative to the second main surface.

REFERENCES:
patent: 1950354 (1934-03-01), De Bats
patent: 2378480 (1945-06-01), Huey
patent: 3740672 (1973-06-01), Presser
patent: 4695678 (1987-09-01), Itagaki et al.
patent: 4779835 (1988-10-01), Fukushima et al.
patent: 4945391 (1990-07-01), Yagoura et al.
IBM Technical Disclosure Bulletin vol. 22, No. 8A, p. 3165, Jan. 1980; "Edge-Mounted Hall Cell Sensor," Katyl.
Farrell, J. S., "Trends Toward Alternative Packaging," Electronic Engineering, vol. 53, Sep. 1981, No. 657, pp. 17-18, 20, and 22-23.
Patent Abstracts of Japan, vol. 6, No. 194 (E-134) [1072], Oct. 2, 1982; Japanese Patent Publication No. 57-106183(A), dated Jul. 1, 1982, Tachibana.
Patent Abstracts of Japan, vol. 6, No. 107 (E-113) [985], Jun. 17, 1982; Japanese Patent Publication No. 57-37889(A), dated Mar. 2, 1982, Nakaya.
Patents Abstracts of Japan, vol. 9, No. 181 (E-331) [1904], Jul. 26, 1985; Japanese Patent Publication No. 60-52063(A), dated Mar. 23, 1985, Watanabe.
Patent Abstracts of Japan, vol. 11, No. 325 (E-551) [2772], Oct. 22, 1987; Japanese Patent Publication No. 62-113454(A), dated May 25, 1987, Hattori.

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