Lead frames with dielectric housings molded thereon

Details Lead frames with dielectric housings molded thereon Lead frames with dielectric housings molded thereon

1984-05-11

1986-07-15

Envall, Jr., Roy N.

Electricity: electrical systems and devices

Miscellaneous

206330, 357 70, 357 75, H05K 502

Patent

active

046009710

ABSTRACT:
Electrical lead frames are stamped from a strip of metal, each of the lead frames including spaced metal strips extending between carrier members. Projections extend outwardly from the metal strips. A dielectric housing is molded onto each of the lead frames and includes recesses in one surface exposing respective projections and holes extending through the housing in communication with the respective projections so that the electrical leads of electronic components and electrical wires can be inserted into the holes in electrical engagement with the projections and secured therein by the projections.

REFERENCES:
patent: 2869040 (1959-01-01), Pifer
patent: 3072734 (1963-01-01), Fox et al.
patent: 3469953 (1969-09-01), St. Clair et al.
patent: 3837001 (1974-09-01), Hughes et al.
patent: 3978375 (1976-08-01), Fukui et al.
patent: 4054238 (1977-10-01), Lloyd et al.
patent: 4168404 (1979-09-01), Lockard

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