Thick-film copper conductor inks

Details Thick-film copper conductor inks Thick-film copper conductor inks

1988-12-02

1989-10-17

Barr, Josephine

Compositions

Electrically conductive or emissive compositions

Free metal containing

252518, 252520, 252521, 106113, 106118, 501 19, 501 73, 501 79, 501 69, 501 70, H01B 106

Patent

active

048745502

ABSTRACT:
Improved copper conductor inks useful in fabricating multilevel circuits are provided. The inks comprise copper powder, a devitrifying glass frit which does not begin to flow until the furnace temperature is above about 700.degree. C., and a suitable organic vehicle. Devitrifying glass frits with these properties include a zinc-calcium-aluminum-silicate glass frit, a zinc-magnesium-barium-aluminum-silicate glass frit, a zinc-magnesium-barium-aluminum-zirconium-phosphosilicate glass frit and mixtures thereof. The inks are advantageous in that they form copper conductor layers having excellent properties without the inclusion of traditional flux materials such as bismuth oxide.

REFERENCES:
patent: 4808770 (1989-02-01), Prabhu et al.

Affiliated with

Also associated with

Rating

Thick-film copper conductor inks does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thick-film copper conductor inks, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thick-film copper conductor inks will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1742297