Process for restricted lead content soldering of copper with con

Details Process for restricted lead content soldering of copper with con Process for restricted lead content soldering of copper with con

1987-06-15

1989-04-04

Ramsey, Kenneth J.

Metal fusion bonding

Process

Plural joints

228222, 22826316, 22826318, B23K 3102

Patent

active

048178578

ABSTRACT:
This is a process which provides the first essentially continuous high tin flow soldering method for attaching copper-based fins to non-copper-based tubing. This invention avoids sludge buildup in the reservoir and generally avoids lead carbonate formation when the heat produced having a braze-like joint with eta phase layers exchanger is in service. In addition, a novel structure is adjacent to copper-containing surfaces. The invention utilizes an essentially lead-free, high tin solder cascade onto a preferably cool tube, genrally with a limited time of contact between the liquid solder and the tube, and with a combination air quench and wipe to remove excess solder and solidify the remaining solder. Thus a braze-like joint is achieved having better heat conduction and closer thermal expansion match. This finned heat exchanger tubing is generally useful for liquid to gas-type heat exchangers.

REFERENCES:
patent: 1720508 (1929-07-01), Bundy
patent: 2152437 (1939-03-01), Lear
patent: 3426953 (1967-02-01), Metzger
patent: 4634044 (1987-01-01), Hargrove et al.
Metals Handbook (8th Ed.), vol. 8, pp. 428-430, Metallographic Structures and Phase Diagrams (ASME).
The Soldering of Sheet Metal Heat Exchangers (4/30/65) Tin Research Institute, Greenford, Middlesex, England (pp. 6-30).
ASTM Spec. B32, p. 1 and 30-38, Nov. 1983 (published Mar. 1984).

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