Method for selectively plating plastics

Chemistry: electrical and wave energy – Processes and products

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204 15, 204 40, 204 41, 204 49, 204 52R, 204 51, 204 384, 427300, 427304, 427305, 252 792, 156901, 156902, C25D 554

Patent

active

046004807

ABSTRACT:
A method for plating first selected surfaces of a platable plastic substrate without plating second selected surfaces is disclosed. The method comprises first electrolessly plating the substrate to provide an electroless metal layer over all of the first selected surfaces and at least a portion of the second selected surfaces. The substrate is then mounted on an electroplating rack so that the current density at the second selected surfaces is lower during electroplating than at the first selected surfaces. The substrate is then electroplated to provide one or more intermediate metal layers which extends over at least all of the first selected surfaces and then electroplated with a final metal different from the metals of the electroless and intermediate layers at a voltage whereby the final metal deposits over the first selected surfaces but not over the second selected surfaces. The electroplated substrate is then immersed in a stripping solution which dissolves the electroless and intermediate metals but not the final metal for a time sufficient to dissolve the electroless and intermediate metals covering the second selected surfaces.

REFERENCES:
patent: 3240684 (1966-03-01), Martin et al.
patent: 3620933 (1971-11-01), Grunwald et al.
patent: 3682784 (1972-08-01), Ryan et al.
patent: 4104111 (1978-08-01), Mach
patent: 4312897 (1982-01-01), Reimann
patent: 4487654 (1984-12-01), Coppin
"Plating on Plastics", by Muller et al, 2nd ed, Robert Draper Ltd., 1971, pp. 126-127.

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