Plastic encapsulated semiconductor device and method for manufac

Details Plastic encapsulated semiconductor device and method for manufac Plastic encapsulated semiconductor device and method for manufac

1982-05-14

1985-03-05

James, Andrew J.

70 81, 70 74, H01L 2158, H01L 2156, H01L 2334, H01L 2300

Patent

active

045034524

ABSTRACT:
A plastic encapsulated semiconductor device and a method for manufacturing the same are provided. A substrate support supports a semiconductor substrate and serves as a heat sink. Strips are connected to one side of the substrate support and an external lead is connected to the opposite side of the substrate support. Parts of the strips extend from one side surface of a plastic encapsulating housing. At least one notch or recess is formed in one side surface of the plastic encapsulating housing. The strips are then cut within at least one notch or recess so as not to extend the cut surfaces of the strips from the outermost side surface portion of the encapsulating housing.

REFERENCES:
patent: 3611250 (1971-10-01), Reed
patent: 3716764 (1973-02-01), Birchler et al.
patent: 3793709 (1974-02-01), Baumann

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