Light-sensitive material containing silver halide, reducing agen

Radiation imagery chemistry: process – composition – or product th – Microcapsule – process – composition – or product

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

430944, 430945, G03C 172, G03C 108

Patent

active

049045610

ABSTRACT:
A light-sensitive material comprises a light-sensitive layer which contains silver halide, a reducing agent, a polymerizable compound and a color image forming substance provided on a support. The silver halide, polymerizable compound and color image forming substance are contained in microcapsules to form light-sensitive microcapsules which are dispersed in the light-sensitive layer. These light-sensitive microcapsules have spectral sensitivity peaks within the wavelength region of 600 nm to 950 nm and composed of at least two kinds of light-sensitive microcapsules differing from each other with respect to spectral sensitivity.

REFERENCES:
patent: 3443948 (1969-05-01), Bryan
patent: 3694252 (1972-09-01), Gerber et al.
patent: 3694253 (1972-09-01), Gerber et al.
patent: 4617257 (1986-10-01), Sawada et al.
patent: 4619892 (1986-10-01), Simpson et al.
patent: 4624910 (1986-11-01), Takeda
patent: 4629676 (1986-12-01), Hayakawa et al.
patent: 4637975 (1987-01-01), Kabodera et al.
patent: 4649098 (1987-03-01), Takeda
patent: 4775656 (1988-10-01), Harada et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Light-sensitive material containing silver halide, reducing agen does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Light-sensitive material containing silver halide, reducing agen, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Light-sensitive material containing silver halide, reducing agen will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-173451

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.