Method for interconnecting an electronic device using a transfer

Details Method for interconnecting an electronic device using a transfer Method for interconnecting an electronic device using a transfer

1996-08-14

1998-12-08

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156234, 156235, 156297, 156300, 22818022, 2282481, B23K 3102

Patent

active

058463666

ABSTRACT:
In accordance with the invention, an electronic device having one or more contact pads is placed in contact with a carrier sheet bearing an array of transferable solder particles. Heat is applied to adhere the solder to the contact pads, and solder is selectively transferred onto the contact pads. In a preferred embodiment the solder-carrying medium comprises elastomeric material and the solder particles comprise solder-coated magnetic particles. Application of a magnetic field while the elastomer is curing produces a regular array of solder coated particles. Using this method, devices having smaller than conventional contact structures can be readily interconnected.

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IBM Technical Disclosure Bulletin, vol. 19, No. 6, Nov. 1976, p. 2049.
IBM Technical Disclosure Bulletin, vol. 17, No. 2, Jul. 1974, p. 627.

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