Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1982-09-27
1985-03-05
Wityshyn, Michael
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
1563043, 156497, 156506, 156518, 156519, 156568, 242 56R, 242 585, B31F 506, B65H 6906
Patent
active
045029040
ABSTRACT:
An audio tape cassette winder (10) is disclosed which includes a splicer (30) which winds splicing tape ("T") onto a cassette ("C"). Tape ("T") is applied by means of a square applicator wheel 85 which simultaneously translates and rotates into and out of tape applying contact with two tape ends ("L" and "A") to be spliced. Application of tape ("T") to tapes to be spliced ("L" and "A") is assisted by positive air pressure through ports (106a-d) on respective tape carrying surfaces (85a-d) as each tape carrying surface successively applies tape ("T") to the tapes to be spliced ("A" and "L"). The positive air pressure is applied only for a very short period of time concurrent with physical impact of successive tape carrying surfaces (85a-d) with the tapes to be spliced ("A" and "L"). The invention proceeds substantially as described above with reference to the apparatus.
REFERENCES:
patent: 2949148 (1960-08-01), Rayburn et al.
patent: 3625799 (1971-12-01), Way
patent: 3717057 (1973-02-01), Takimoto
patent: 3737358 (1973-06-01), King
patent: 3939031 (1976-02-01), Takimoto
patent: 3960641 (1976-06-01), Pedersen
patent: 4052249 (1977-10-01), Bruce et al.
patent: 4230520 (1980-10-01), Morgan
patent: 4328066 (1982-05-01), Kiuchi et al.
Adams, III W. Thad
American Multimedia, Inc.
Wityshyn Michael
LandOfFree
Method and apparatus for applying splicing tape with positive ai does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for applying splicing tape with positive ai, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for applying splicing tape with positive ai will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1732780