Heat sink for printed circuit board

Details Heat sink for printed circuit board Heat sink for printed circuit board

1999-03-16

2000-11-28

Thompson, Gregory

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174252, 361720, H05K 720

Patent

active

061543675

ABSTRACT:
An electronic component and heat sink assembly comprising at least one printed circuit board and a first heat transfer member sandwiched between portions of the at least one printed circuit board. The electronic components on the printed circuit board(s) are directly thermally connected to the heat transfer member on at least two different sides of the heat transfer member.

REFERENCES:
patent: 5050039 (1991-09-01), Edfors
patent: 5276584 (1994-01-01), Collins et al.
patent: 5402313 (1995-03-01), Casperson et al.
patent: 5812375 (1998-09-01), Casperson
patent: 5831828 (1998-11-01), Cutting et al.

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