Connection system for integrated circuits which reduces cross-ta

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

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174117M, 361778, H05K 100

Patent

active

052889491

ABSTRACT:
The invention concerns a Multi-Chip Module (MCM), which can be viewed as similar to a printed circuit board, but with the conductors interwoven in a 3-dimensional array. In the invention, the conductors are arranged such that both power supply conductors and ground conductors are interwoven around signal conductors, and provide shielding for the signal conductors, thus reducing cross-talk.

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