Metal working – Method of mechanical manufacture – Assembling or joining
Patent
1983-04-05
1985-07-16
Hearn, Brian E.
Metal working
Method of mechanical manufacture
Assembling or joining
29578, 29577C, 29590, 148 15, 148179, H01L 2188
Patent
active
045287449
ABSTRACT:
A method of manufacturing a semiconductor device which comprises the steps of forming an interconnection layer through an insulating film on a semiconductor substrate, and connecting the diffusion interconnection region in the surface portion of said substrate to said interconnection layer by growing a metal or metal semiconductor compound on the surface of said substrate and the interconnection layer.
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M. Morimoto et al; Japan J. Appl. Phys. vol. 20 Supp. 20-1, pp. 123-127, 1981.
T. Shibata et al.; iedm Technical Digest, pp. 647-650, 1981, (See Especially FIG. 5).
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IBM Technical Disclosure Bulletin, Interconnection Method for Integrated Circuits, C. J. Kircher & H. N. Yu, vol. 13, No. 2, Jul. 1970.
Auyang Hunter L.
Hearn Brian E.
Tokyo Shibaura Denki Kabushiki Kaisha
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