Electroplating apparatus for plate-shaped workpieces, particular

Details Electroplating apparatus for plate-shaped workpieces, particular Electroplating apparatus for plate-shaped workpieces, particular

1988-01-22

1989-05-23

Tufariello, T. M.

Chemistry: electrical and wave energy

Apparatus

Electrolytic

C25D 1700

Patent

active

048328111

ABSTRACT:
An electroplating apparatus for plating plate-shaped workpieces, particularly printed circuit boards, as they move in a horizontal path through a tank of electrolyte between an upper anode and a lower anode characterized by the device including four electrolyte headers arranged with a pair at the input of the path between the upper and lower anodes, and a pair at the end of the path between the upper and lower anodes, with each pair having one header disposed above the path and one header disposed below the path. Each of the headers as a plurality of openings extending at an attack angle to the horizontal path to create both horizontal and vertical components for a flow of the electrolyte between the surfaces of the workpieces and each of the upper and lower anodes.

REFERENCES:
patent: 3535222 (1970-10-01), Cooke et al.
patent: 3650935 (1972-03-01), Andersson
patent: 4347115 (1982-08-01), Espenhahn et al.
patent: 4385967 (1983-05-01), Brady et al.
patent: 4401523 (1983-08-01), Avellone

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