Lead with slits for reducing solder overflow and eliminating air

Details Lead with slits for reducing solder overflow and eliminating air Lead with slits for reducing solder overflow and eliminating air

1995-07-31

1997-05-20

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361772, 361728, 174261, 2281791, 2281801, 22818021, 228258, 257692, 257693, 439874, H01L 23488, H05K 334, B23K 3514, H01R 402

Patent

active

056318065

ABSTRACT:
The portion of the lead which is soldered between electrical components in a circuit module includes one or more radially extending slits. Once heated, the fluid solder is drawn into the slits by capillary action. Trapped air escapes, eliminating air pockets or gaps. The result is a stronger joint and a reduction in solder overflow.

REFERENCES:
patent: 3275736 (1966-09-01), Hotine et al.
patent: 4303935 (1981-12-01), Ragaly
patent: 4328512 (1982-05-01), Heyke et al.
patent: 4987474 (1991-01-01), Yasuhara et al.
patent: 5371647 (1994-12-01), Fried et al.
patent: 5460319 (1995-10-01), Kato

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