Multi-die encapsulation device

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type

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Details

439 69, H01R 909

Patent

active

057674434

ABSTRACT:
Disclosed is an encapsulation device for bare die. The encapsulation device includes chambers having parallet walls, an insertion void, and a spring retention electrical contact having a compliant foot and comprises a cap having a compression pad. The encapsulation device of the invention provides a reliable contact between the die and a mounting board via the compliant foot. The insertion void allows for a safe insertion of a die into a chamber of the encapsulation device. The compression pad and the spring retention electrical contact provide positive retainment of the bare die within the encapsulation device.

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AMP Product Specification PIB 65559 Issued Jan. 1993 AMP Inc. Harrisburg, PA 17105.

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